| abstract |
The present invention provides a thermally conductive silicone grease composition that has a small increase in hardness and a small decrease in elongation when subjected to heat aging at high temperature after curing. (A) An organopolysiloxane having at least two alkenyl groups in one molecule and having a kinematic viscosity at 25 ° C. of 5,000 to 100,000 mm 2 / s, (B) The following general formula (1) (R 1 is an alkyl group having 1 to 6 carbon atoms, and a is an integer of 5 to 100.) (C) 10 W / m · ° C. Thermally conductive filler having the above thermal conductivity, (D) organohydrogenpolysiloxane containing hydrogen atoms (Si-H groups) directly connected to 2 or more and 5 or less silicon atoms in one molecule, ( E) A thermally conductive silicone grease composition comprising an adhesion promoter having a triazine ring and at least one alkenyl group in one molecule, and (F) a catalyst selected from the group consisting of platinum and a platinum compound. [Selection figure] None |