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filingDate 2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020063380-A
titleOfInvention Thermally conductive silicone composition
abstract PROBLEM TO BE SOLVED: To provide a thermally conductive silicone composition which does not increase in hardness after curing even when exposed to high temperature for a long time and does not flow out after mounting. SOLUTION: (A) an organopolysiloxane having two or more silicon-bonded alkenyl groups in one molecule and a kinematic viscosity at 25 ° C. of 10 to 100,000 mm 2 / s, (B) the following formula (1) (R 1 is an alkyl group, a is 5 to 100), one terminal trifunctional hydrolyzable methylpolysiloxane, (C) a heat conductive filler having a thermal conductivity of 10 W / m ° C. or higher, ( D) Organohydrogenpolysiloxanes each having one or more hydrogen atoms directly bonded to silicon atoms in one molecule at the terminal site and side chain sites, and two or more in one molecule other than component (E) (D) A thermally conductive silicone composition containing a specific amount of the organohydrogenpolysiloxane containing a hydrogen atom directly bonded to the silicon atom, (F) a catalyst selected from the group consisting of platinum and a platinum compound. [Selection diagram] None
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