| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-14 |
| filingDate |
2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2019235293-A1 |
| titleOfInvention |
Thermally conductive silicone composition and its manufacturing method |
| abstract |
Organopolysiloxane having (A) an alkenyl group bonded to a silicon atom and (B) organohydrogenpolysiloxane are combined with an alkenyl group bonded to a silicon atom in (A) component and Si- in (B) component. Organopolysiloxane, which is a reaction product reacted at a molar ratio (Si—H / Si—Vi) of 2.0 to 9.0 with an H group. A thermally conductive silicone composition containing (C) an inorganic filler having an average particle size of 3 μm or less selected from metal oxides and metal nitrides, and (D) a thermally conductive inorganic filler having an average particle size of 5 μm or more. The total of the components (C) and (D) is 200 to 6,000 parts by mass with respect to the total of 100 parts by mass of the components (A) and (B), and the absolute viscosity at 25 ° C. is 100. A thermally conductive silicone composition having a temperature of about 800 Pa · s is provided, and a thermally conductive silicone composition having excellent slip resistance and coatability and a method for producing the same are provided. |
| priorityDate |
2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |