| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate |
2020-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_869b51e4d6b6a6acea6edfc93c0e028c |
| publicationDate |
2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021059936-A1 |
| titleOfInvention |
Thermally conductive silicone composition, production method thereof, and semiconductor device |
| abstract |
This thermally conductive silicone composition contains: (A) 100 parts by mass of a diorganopolysiloxane in which both terminals of a molecular chain are blocked with hydroxy groups; (B) 150-600 parts by mass of an organopolysiloxane with a particular structure having at least one hydrolyzable silyl group in one molecule; (C) 0.1-100 parts by mass of a crosslinking agent component; (D) 1,500-6,500 parts by mass of zinc oxide particles which have an average particle diameter of 0.1 μm to 2 μm, and in which the content ratio of a coarse powder having a particle diameter of 10 μm or more in a laser diffraction-type particle size distribution is 1 vol% or less with respect to the total amount of component (D); and (E) 0.01-30 parts by mass of an adhesion promoter, wherein the content of component (D) is 45-70 vol% with respect to the total composition. This thermally conductive silicone composition has a higher thermal conductivity than the prior art, can be compressed to a thickness of 10 μm or less, and also has high durability. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021235259-A1 |
| priorityDate |
2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |