| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f870b2e96757d40c12be160dcc127a1 |
| publicationDate |
2019-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019235293-A1 |
| titleOfInvention |
Thermally conductive silicone composition and method for producing same |
| abstract |
The present invention provides a thermally conductive silicone composition which contains: an organopolysiloxane which is a reaction product obtained by reacting (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogen polysiloxane with each other at a molar ratio of the Si-H group in the component (B) to the alkenyl group bonded to a silicon atom in the component (A), namely (Si-H/Si-Vi) of 2.0-9.0; (C) an inorganic filler which is selected from among metal oxides and metal nitrides, and which has an average particle diameter of 3 μm or less; and (D) a thermally conductive inorganic filler which has an average particle diameter of 5 μm or more. This thermally conductive silicone composition has excellent displacement resistance and excellent coatability by setting the total of the component (C) and the component (D) to 200-6,000 parts by mass relative to 100 parts by mass of the total of the component (A) and the component (B), and having an absolute viscosity at 25°C of 100-800 Pa·s. The present invention also provides a method for producing this thermally conductive silicone composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020153217-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7111187-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7276212-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020153217-A1 |
| priorityDate |
2018-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |