| abstract |
(A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane having a hydrogen atom (Si—H group) bonded to a silicon atom are (Si—H / Si−). Vi) Organopolysiloxane, which is a reaction product reacted at more than 8.0 and at 20.0 or less. (C) an inorganic filler having an average particle size of 3 μm or less selected from metal oxides and metal nitrides, and (D) a thermally conductive inorganic filler having an average particle size of 5 μm or more. The total amount of the component (C) and the component (D) is 3,500 to 12,000 by mass with respect to 100 parts by mass of the total of the component (A) and the component (B). A silicone composition having a thermal conductivity of 4 W / m · K or more and an absolute viscosity of 100 to 1,000 Pa · s is excellent in slip resistance and coatability. It is an object of the present invention to provide a highly thermally conductive silicone composition and a method for producing the same. |