| abstract |
A thermally conductive silicone composition disposed between a heat-generating electronic component and a heat dissipation member, (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinematic viscosity at 25 ° C. of 10 to 100,000 mm 2 / s, (B) One-terminal trifunctional hydrolyzable dimethylpolysiloxane represented by the general formula (1), (C) a thermally conductive filler having a thermal conductivity of 10 W / m ° C. or higher, (D) an organohydrogenpolysiloxane represented by the general formula (2), (E) Organohydrogenpolysiloxane containing hydrogen atoms directly bonded to at least two silicon atoms in one molecule other than component (D), (F) It contains a catalyst selected from the group consisting of platinum and platinum compounds, has an appropriate range of storage elastic modulus, loss elastic modulus and loss coefficient, and causes pump-out and peeling during a cooling / heating cycle. Provided is a thermally conductive silicone composition that is hard to give a cured product in which an increase in thermal resistance is suppressed. |