| abstract |
A semiconductor wafer having bump electrodes can be thermocompression bonded to an electrode side, cut and separated into individual semiconductor elements by dicing, and then directly bonded by flip-chip connection, and firmly fix the substrate to achieve high mounting reliability. Provided are an adhesive film for a semiconductor that can obtain the property, a semiconductor device using the same, and a method for manufacturing the same. An insulating adhesive film for a semiconductor, comprising a polyimide resin, an epoxy resin, a phenol resin, and an inorganic filler soluble in an organic solvent as essential components, and bonding the bump end surface using the adhesive film. A semiconductor device manufactured by a manufacturing method having a step of exposing from a film. |