abstract |
The present invention provides an adhesive composition having excellent properties of both preservation and connection reliability, comprising (a) an organic solvent-soluble polyimide, (b) an epoxy compound, (c) curing accelerator particles and (d) inorganic particles, with respect to 100 parts by weight of (b) epoxy compound, the content of (a) organic solvent-soluble polyimide is 15 to 90 parts by weight, (c) curing accelerator The content of the agent particles is 0.1 to 50 parts by weight, and the content of (d) inorganic particles is 30% by weight or more and 80% by weight or less based on the total amount of (a) to (d). |