| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition containing a polyimide resin, which can be suitably used as a substrate material for a printed wiring board by satisfying both a low melt viscosity before curing and a low linear expansion coefficient after curing, and the use thereof And typical use technology such as printed wiring boards. A filler-containing resin composition according to the present invention contains a thermoplastic polyimide resin component, a thermosetting component, and a filler component, and spherical silica is used as the filler component. Thereby, while realizing a low melt viscosity and exhibiting excellent workability, the linear expansion coefficient of the resin composition can be reduced. As a result, a polyimide resin composition suitable as a substrate material for a printed wiring board can be provided, and by using this, a printed wiring board having excellent quality can be obtained. [Selection figure] None |