| abstract |
Provided is an adhesive composition having both excellent storability and excellent connection reliability. The adhesive composition comprises (a) a polyimide soluble in organic solvents, (b) an epoxy compound, (c) particles of a curing accelerator, and (d) inorganic particles, the amounts of the organic-solvent-soluble polyimide (a) and the curing-accelerator particles (c) being 15-90 parts by weight and 0.1-50 parts by weight, respectively, per 100 parts by weight of the epoxy compound (b), and the content of the inorganic particles (d) being 30-80 wt.% of the total amount of (a) to (d). |