abstract |
<P>PROBLEM TO BE SOLVED: To provided an adhesive composition for semiconductor that permits handling without the occurrence of cracking or peeling even after flexing, permits laminating on the electrode side of a semiconductor wafer with bump electrode of bump electrode narrow pitch and high pin number at the time of laminating, and that at the time of dicing, permits high-speed cutting without any cut powder contamination or defect, facilitating recognition of alignment marks at the time of dicing and flip chip mounting. <P>SOLUTION: The adhesive composition for semiconductor comprises (a) an organic solvent soluble polyimide, (b) an epoxy compound, and (c) a curing accelerator, wherein (a) 15-90 parts by weight of an organic solvent-soluble polyimide and (c) 0.1-10 parts by weight of a curing accelerator are included to 100 parts by weight of an epoxy compound (b), and wherein the epoxy compound (b) contains a compound being liquid at 25 °C under 1.013×10<SP>5</SP>N/m<SP>2</SP>and a compound being solid at 25°C under 1.013×10<SP>5</SP>N/m<SP>2</SP>, and wherein the ratio of the compound being liquid based on all the epoxy compounds is in the range of 20-60% by weight. <P>COPYRIGHT: (C)2007,JPO&INPIT |