| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate |
2011-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7128a6e2ef0a7803468dd4b7ed320608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be8d2f928ff08b988c14e1ae82ebdb94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16138324678076211cac4fa7b3ae523b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b775288809fe22b37305890f78f48338 |
| publicationDate |
2012-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012162658-A |
| titleOfInvention |
Insulating adhesive for semiconductor |
| abstract |
An object of the present invention is to obtain an insulating film for semiconductor adhesion that does not cause a significant decrease in insulation even when mounted at high temperature and high pressure. [Solution] (A) A microcapsule-type curing agent, (B) an epoxy resin, and (C) an insulating adhesive for a semiconductor containing an organic solvent-soluble polyimide, and a reaction peak temperature measured by DSC of the insulating adhesive for semiconductor An insulating adhesive for semiconductor, which has a temperature of 170 to 200 ° C. and has (A) particles of an amine-based curing agent inside the microcapsule of the microcapsule-type curing agent. [Selection figure] None |
| priorityDate |
2011-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |