| abstract |
To provide an adhesive film for a semiconductor which can be slit-processed and does not adhere to each other even when the rolls are stacked and stored, and has a layer of a semiconductor adhesive composition having a uniform thickness when used. An adhesive film for a semiconductor formed on a bump electrode surface of a semiconductor wafer, comprising (a) an organic solvent-soluble polyimide, (b) an epoxy compound, and (c) a microcapsule type curing accelerator, b) 100 parts by weight of the epoxy compound, (a) 10 to 90 parts by weight of the organic solvent-soluble polyimide, (c) 25 to 50 parts by weight of the microcapsule type curing accelerator, and (b) the epoxy compound is liquid. An adhesive film for a semiconductor comprising an epoxy compound and a solid epoxy compound, wherein the content of the liquid epoxy compound is from 50% by weight to 95% by weight based on the total epoxy compound, and further has a peelable substrate α. [Selection figure] None |