| abstract |
PROBLEM TO BE SOLVED: To provide a film-like epoxy resin composition and a film-like adhesive which have high fluidity at the time of melting and can ensure sufficient adhesiveness at a pressure lower than that in the past. A liquid epoxy resin having a dynamic viscosity at 25 ° C. of 100 Pa · s or less is 50% by weight or more of the epoxy resin and has a softening point of 125 ° C. or less having at least two hydroxyl groups in the molecule. Contains a curing agent, and further contains 5-45 parts by weight of a sheeting agent having a molecular weight of 10,000 to 1,000,000 with respect to a total of 100 parts by weight of the epoxy resin and the curing agent, and when heated and melted A film-like epoxy resin composition having a dynamic viscosity of 100 to 5,000 Pa · s. [Selection figure] None |