http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013115185-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27c26f745089460e45b9056460b32379 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d |
| publicationDate | 2013-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013115185-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method capable of suppressing a void at the time of mounting a semiconductor element and manufacturing a highly reliable semiconductor device. The present invention relates to a semiconductor including an adherend, a semiconductor element electrically connected to the adherend, and an underfill material that fills a space between the adherend and the semiconductor element. A method for manufacturing an apparatus, the step of preparing a sealing sheet comprising a base material and an underfill material laminated on the base material, and the sealing sheet on the surface on which the connecting member of the semiconductor wafer is formed A step of bonding, a step of dicing the semiconductor wafer to form the semiconductor element with the underfill material, a step of holding the semiconductor element with the underfill material at 100 to 200 ° C. for 1 second or more, And a step of electrically connecting the semiconductor element and the adherend via the connecting member while filling a space between the adherend and the semiconductor element with an underfill material. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019197840-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020004909-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7149099-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020003653-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11443985-B2 |
| priorityDate | 2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.