| abstract |
A film-like adhesive capable of supporting a flip-chip connection method and a method of manufacturing a semiconductor device using the same are provided. SOLUTION: The minimum melt viscosity is higher than 200 Pa · s at 50 to 250 ° C., and the flow amount of the film adhesive sandwiched between parallel plates when heated and pressurized to 50 to 150 ° C. is 1.5 or more. And film-like adhesive 10 having an average linear expansion coefficient between 25 and 260 ° C. of 200 × 10 −6 / ° C. or less. The step of attaching the film adhesive to the substrate 8 on which the wiring pattern 9 is formed, the step of aligning the connection terminal of the semiconductor chip 13 having the protruding connection terminal 15 and the wiring pattern of the substrate, heating and pressing In order to increase the curing reaction rate of the film adhesive to 80% or more by electrically connecting the protruding connection terminal of the semiconductor chip and the wiring pattern of the substrate by metal bonding by applying ultrasonic vibration A method for manufacturing a semiconductor device, comprising a step of performing a heat treatment. [Selection] Figure 3 |