| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2017-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_741de79b22a8f9ec086ec481baf0fb69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d22cceb2ffa1bbecddc1ce6499d8fb4 |
| publicationDate |
2020-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10793718-B2 |
| titleOfInvention |
Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same |
| abstract |
A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness. |
| priorityDate |
2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |