| abstract |
PROBLEM TO BE SOLVED: To provide an interlayer insulating film, a BPSG film, a shallow film, capable of polishing a surface to be polished at high speed without scratches, capable of flattening, excellent in storage stability, and easy in process management. An interlayer insulating film, a BPSG film, a CMP polishing agent suitable for polishing an insulating film for trench isolation and the like, which can polish a surface to be polished at a high speed without scratching, and which can achieve high flattening and easy process management. Provided is a substrate polishing method suitable for polishing an insulating film for isolating a shallow trench. SOLUTION: The CMP polishing agent containing cerium oxide particles, a dispersant, two or more additives and water, and a substrate on which a film to be polished is formed are pressed against a polishing cloth of a polishing platen and pressurized, and the CMP polishing is performed. A substrate polishing method for polishing a film to be polished by moving a substrate and a polishing plate while supplying an agent between a polishing film and a polishing cloth. |