Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64ce9e67b090644ea50f977c57776a34 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
filingDate |
2005-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda407a4908afb944afc895ebc54cf4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74abb7480f040335758b82111e347b8b |
publicationDate |
2006-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2006278522-A |
titleOfInvention |
Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
abstract |
PROBLEM TO BE SOLVED: To manufacture a semiconductor integrated circuit device with less pattern dependency of a polishing rate when polishing a surface to be polished of a silicon dioxide-based material layer, and can preferentially polish the convex portion while suppressing the polishing of the concave portion, Provided is a technique capable of highly planarizing a surface to be polished with an extremely small polishing amount. In manufacturing a semiconductor integrated circuit device, cerium oxide is used as a chemical mechanical polishing abrasive for polishing a polished surface when the polished surface is a polished surface of a silicon dioxide-based material layer. An abrasive containing particles, a water-soluble polyamine, and water is used. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017178986-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009535816-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008032680-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008032681-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5157908-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008032680-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008032681-A1 |
priorityDate |
2005-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |