| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3cba7ea7d18d653da0f0c12c3b61473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64ce9e67b090644ea50f977c57776a34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7c92ede530c6c5c5d579e0a26060648 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af85d37890ea180a23f6b214616f1731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9f5454955eb4f7dba599e690a628c4d |
| publicationDate |
2006-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006103858-A1 |
| titleOfInvention |
Abrasive for semiconductor integrated circuit device, method of polishing therewith and process for producing semiconductor integrated circuit device |
| abstract |
In connection with the production of a semiconductor integrated circuit device, it is intended to provide a technology in which the dependence on pattern of polishing speed in the event of polishing a target surface of silicon dioxide material layer is reduced, in which while suppressing the polishing of depressed portions, protrudent portions can preferentially be polished, and in which high planarization of the polishing surface can be achieved with an extremely reduced polished amount. There is provided a process for producing a semiconductor integrated circuit device, comprising using an abrasive containing cerium oxide particles, a water soluble polyamine and water as an abrasive for chemical mechanical polishing for polishing of a target surface in the event that the target surface is a polishing surface of silicon dioxide material layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010052990-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7857680-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7618723-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010052990-A1 |
| priorityDate |
2005-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |