| abstract |
A photosensitive resin composition that is excellent in flame retardancy and plating resistance and can form a cured film having various properties required for a solder resist, and a photosensitive film and a photosensitive permanent resist using the same. To provide. A photosensitive resin containing (a) a binder polymer, (b) a polymerizable compound having an ethylenically unsaturated group, (c) a polymerization initiator, (d1) an organic phosphorus compound, and (d2) an inorganic filler. Composition. [Selection figure] None |