http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101511416-B1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 |
filingDate | 2011-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2015-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2015-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101511416-B1 |
titleOfInvention | Resin composition for polyester base material, and dry film and printed circuit boards using same |
abstract | The present invention relates to a resin composition for a polyester substrate, which is capable of achieving halogen-free flame retardancy even with a printed wiring board using a polyester substrate, and is capable of forming a coating film layer excellent in low warpage, ≪ / RTI > The thermosetting resin composition can further contain a thermosetting component having a plurality of cyclic ether groups and / or cyclic thioether groups in the molecule in addition to the above components. Further, the thermosetting resin composition can further contain a photopolymerization initiator or a photopolymerizable monomer, Composition. By using such a resin composition or a dry film thereof, it is possible to provide a printed wiring board in which a flame-retardant cured film is formed. |
priorityDate | 2010-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 503.