abstract |
In order to form a film coating that is able to achieve halogen-free flame resistance and that, also, has superior, low warping characteristics, even on printed circuit boards that use a polyester base, the resin composition for the polyester base material contains a resin that contains a carboxyl group, titanium oxide and a phosphorous compound. A thermosetting resin composition can be obtained by further including a thermosetting component that has a plurality of cyclic ether groups and/or cyclic thioether groups in a molecule, in addition to each of the aforementioned components. Furthermore, a photocurable, thermosetting resin can be obtained by including photopolymerisation initiators or photopolymerising monomers. A printed circuit board, which is formed of flame-resistant hard-setting film formed by said components, is provided by using the kind of resin composition described or a dry film thereof. |