| abstract |
Disclosed is an alkali-developable photosensitive resin composition which comprises a carboxylated urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus compound. By further incorporating a heat-curable ingredient having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the ingredients described above, a photo- and heat-curable resin composition can be obtained. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured coating film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured coating film being flame-retardant and reduced in warpage and having various excellent properties including bendability, soldering heat resistance, and resistance to gold plating. |