abstract |
A curable resin composition containing a halogen-free colorant and a flame retardant and capable of forming a solder resist layer having low warpage and excellent concealment of appearance defects caused by discoloration due to oxidation of a copper circuit. Provided are a hard resin composition, a dry film thereof, and a printed wiring board on which a flame-retardant cured film such as a solder resist is formed. A curable resin composition contains (A) a carboxyl group-containing resin, (B) titanium oxide, and (C) aluminum hydroxide. In addition to the above components, (D) a thermosetting resin composition containing two or more cyclic ether groups and / or cyclic thioether groups in the molecule can be used as a thermosetting resin composition, Furthermore, it can be set as a photocurable thermosetting resin composition by containing the photoinitiator (F) and the photopolymerizable monomer (G). Preferably, it further contains (E) a phosphorus-containing compound. [Selection figure] None |