| abstract |
[PROBLEMS] To provide a curable resin composition capable of maintaining a high thixotropy ratio even after a long time after preparation to prevent the occurrence of sagging, and further capable of forming a coating film excellent in solder heat resistance and finished appearance. SOLUTION: It contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound, and (E) an organophosphate. A curable resin composition. [Selection figure] None |