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publicationDate 2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2014051035-A1
titleOfInvention Photocurable resin composition, printed wiring board, and method for producing photocurable resin composition
abstract Provided is a photocurable resin composition which is capable of providing a cured product that is highly filled with a filler. A photocurable resin composition which contains a carboxyl group-containing resin, a photopolymerization initiator, and two or more kinds of fillers having different primary particle diameters, and which is characterized in that, among the two or more kinds of fillers, at least one kind of a filler is blended in the form of a powder and at least one kind of a filler is blended in the form of a slurry. It is preferable that the photocurable resin composition has a particle size distribution (D 50 ) of 3.0 μm or less and a particle size distribution (D 90 ) of 8.0 μm or less.
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