| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9a57f71cc7d7eb772f50137d55fbde |
| publicationDate |
2002-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002241585-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which is excellent in heat strength and solder resistance. SOLUTION: In the epoxy resin composition for encapsulating a semiconductor device using a lead frame, a silane cup containing at least one element other than C, O and H among elements contained in a plating solution used for the lead frame. An epoxy resin composition for semiconductor encapsulation, comprising a ring agent as an essential component. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008201873-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007077236-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005336362-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005314566-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007194425-A |
| priorityDate |
2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |