http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002206016-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-02 |
| filingDate | 2001-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8143b1dddf3e66be8e2e70ac832b4718 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42fc65032beecb6f459e1867a3c8a6bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6359d25410ed86f5dded0a644005a11f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_554e243b4b7631ddff35c6802c31f9f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a70060b361527606fab678e40d228b16 |
| publicationDate | 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002206016-A |
| titleOfInvention | Resin composition for semiconductor encapsulation, and semiconductor device using the same |
| abstract | (57) [Summary] [PROBLEMS] For sealing applications requiring high thermal conductivity, such as power devices, it is possible to improve the reliability as a device with excellent low stress and excellent adhesion to a nickel plating frame. Provided are a resin composition for semiconductor encapsulation and a semiconductor device. SOLUTION: (A) a mixture of an epoxy resin having a dicyclopentadiene skeleton and a novolak type epoxy resin, (B) a coupling agent containing a thiol group, (C) It contains crystalline silica as an essential component. (A) Preferably, the content of the epoxy resin having a dicyclopentadiene skeleton in the epoxy resin mixture as a component is in the range of 10 to 50% by weight of the total amount of the mixture, It is preferable to use γ-mercaptopropyltrimethoxysilane as the coupling agent as the component (B). A semiconductor element is sealed using the resin composition for semiconductor sealing to obtain a semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018513889-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9796828-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015019407-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002241585-A |
| priorityDate | 2001-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.