| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in solder resistance and a semiconductor device, which has high adhesion strength to a lead frame and does not peel off from the lead frame during solder processing. SOLUTION: (A) epoxy resin, (B) phenol resin, (C) curing accelerator, (D) inorganic filler, (E) aromatic carboxylic acid, and (F) silane coupling agent having mercapto group An epoxy resin composition for encapsulating a semiconductor, preferably, the aromatic carboxylic acid contains at least two phenolic hydroxyl groups per molecule and at least one or more phenolic hydroxyl groups per molecule. An epoxy resin composition for semiconductor encapsulation, which is a compound having a carboxyl group. |