| abstract |
A circuit connection adhesive capable of improving the connection reliability between a protruding electrode of an electronic component and a wiring electrode of a circuit board when the electronic component and the circuit board are connected via an adhesive for circuit connection. The purpose is to provide. A circuit comprising, as a main component, at least one thermosetting resin selected from an epoxy resin, a phenol resin, a polyurethane resin, an unsaturated polyester resin, and a urea resin, and containing conductive particles and a silane coupling agent. The protruding electrode 5 of the electronic component 3 and the wiring electrode 4 of the circuit board 1 are connected through the connecting adhesive 2. And the silane coupling agent contained in the adhesive 2 for circuit connection contains the silane coupling agent which has a mercapto group. [Selection] Figure 1 |