http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005105086-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a9da31b49e429237329ce52da6fa25 |
| publicationDate | 2005-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005105086-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high adhesion strength to a lead frame and excellent in solder resistance, and a semiconductor device. SOLUTION: (A) epoxy resin, (B) phenol resin, (C) curing accelerator, (D) inorganic filler and (E) aromatic carboxylic acid (preferably at least two phenols per molecule) A compound having a functional hydroxyl group and at least one carboxylic acid per molecule), and an epoxy resin composition for encapsulating a semiconductor, and a semiconductor element is encapsulated using the epoxy resin composition A semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005314566-A |
| priorityDate | 2003-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.