| abstract |
(57) [Summary] [Problem] A semiconductor that can achieve flame retardancy with non-halogen and non-antimony, has good moldability such as fluidity, and has excellent reliability such as reflow crack resistance, moisture resistance and high temperature storage characteristics. Provided is an epoxy resin molding material for sealing. (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a compound having two or more phenolic hydroxyl groups in one molecule represented by the following formula (I): 1) (Where R 1 to R 9 may be the same or different from each other and are selected from hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkoxyl group, an aryl group and an aralkyl group, and n is 0 to 10 is shown. (C) an adduct of a tertiary phosphine with a quinone compound; (D) An epoxy resin molding compound for sealing which contains an inorganic filler as an essential component and does not contain a compound containing halogen and / or antimony. |