http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003105175-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c23ffa8aaf42846544ab63b214effbc0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b9c07d6d42728a4e4f19515ba5b7ccd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e851e20add99f1617a784a909909710 |
| publicationDate | 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003105175-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition which is excellent in flame retardancy, reflow resistance such as adhesion during reflow, swelling characteristics and filling property during molding. An epoxy resin composition containing an epoxy resin (A), a curing agent (B), and a filler (C), wherein the epoxy resin (A) is a tetracarboxylic acid represented by the following general formula (I): It is characterized by containing a methyl bisphenol F type epoxy resin, and the bromo compound is 0.3% of the whole composition. % By weight and the antimony compound is 0.3% by weight or less of the whole composition, and the proportion of the filler (C) is more than 87% by weight and 98% by weight or less of the whole composition. The epoxy resin composition characterized by the above-mentioned. |
| priorityDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.