| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_709038b8bb2d97bf6a5b66771e6eb6b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_063681fa0378fc501023da0bd89e4a2d |
| publicationDate |
2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007077236-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| abstract |
Disclosed is an epoxy resin composition for encapsulating a semiconductor, which has excellent adhesion to a metal and has good fluidity and excellent moldability. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (D). (A) Epoxy resin. (B) Phenolic resin. (C) A silane coupling agent having a —S—S— bond in the molecular structure. (D) Reducing compound. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015221870-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012072209-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014080479-A |
| priorityDate |
2005-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |