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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
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filingDate 2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007194425-A
titleOfInvention Tablet-like semiconductor encapsulating material, method for producing the same, and semiconductor device using the same
abstract Disclosed is a tablet-shaped semiconductor sealing material that forms a sealing resin (cured body) having excellent adhesion to a lead frame and good solder resistance. [MEANS FOR SOLVING PROBLEMS] Molded by tableting into a tablet using an epoxy resin composition for semiconductor encapsulation containing the following components (A) to (C) and further containing the following component (D): A tablet-shaped semiconductor encapsulating material. And the moisture content in the said tablet-shaped semiconductor sealing material is set to the range of 0.03-0.5 weight%. (A) Epoxy resin. (B) Curing agent. (C) Inorganic filler. (D) Water. [Selection figure] None
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