| abstract |
The present invention relates to a composition which is used for the formation of undercoat films and which is made of a highly soluble material in an organic solvent, which is capable of forming an underlay film unlikely to crack in a treatment. at a relatively low temperature in the environment, and which allows a coated film to have a high degree of persistence with respect to an organic solvent when an undercoat film is formed. The invention comprises: a composition for forming underlayer films which is intended to form an underlayer film used for pattern formation and which comprises a copolymer and an organic solvent. The copolymer has a polymerization portion a and a polymerization portion b. The polymerization part a has a sugar derivative part, this sugar derivative part being a pentose derivative part and / or a hexose derivative part, and the polymerization part b has no derivative part sugar. The invention also includes a pattern formation method. |