| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7689e9aa4e22ebbe003ff5f0db439d9a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95c227289421b5873d9cf0b706b7672f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_065fc0b353a5dc8df974290aab8702f8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2010-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0442a593748a03e35e58ad67b5ab661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d60aaa40971c32fa9bb56838178b288 |
| publicationDate |
2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9497857-B2 |
| titleOfInvention |
Insulating sheet, circuit board, and process for production of insulating sheet |
| abstract |
An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler. |
| priorityDate |
2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |