| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C47-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 |
| filingDate |
1999-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deba6f71f1769c9b3cbddbd1e2109c61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08a1f16725075fbf59666df648467063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d46aaa7f5ed59d529004fb5dae9317a9 |
| publicationDate |
2000-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000343577-A |
| titleOfInvention |
Method for producing thermally conductive silicone molding |
| abstract |
(57) [Problem] To provide a method for producing a highly heat-conductive silicone molded article suitable for producing a heat radiation member of an electronic device. A method for producing a thermally conductive silicone molded article, comprising extruding a silicone composition raw material containing a thermally conductive filler and silicone at a shear rate of 20 s -1 or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011048885-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4514344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002237554-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9497857-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021046562-A |
| priorityDate |
1999-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |