http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004335929-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
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filingDate 2003-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_043aafbd46b05cd0cdfff85791c1576c
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publicationDate 2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004335929-A
titleOfInvention Method of manufacturing metal-based circuit board
abstract Provided is a method of manufacturing a metal-based circuit board having excellent reliability with good productivity, particularly, by reducing loss during circuit formation. SOLUTION: (1) A step of applying an insulating adhesive composition 3 on a metal foil 1 supplied continuously and curing the insulating adhesive composition, (2) Adhesion further supplied continuously The resin film 5 with the adhesive is laminated on the layer made of the insulating adhesive composition so that the adhesive faces the adhesive, and the metal foil, the insulating adhesive composition, and the resin film with the adhesive are pressure-bonded with a roll to be integrated. (3) a step of continuously or intermittently forming a metal foil of the metal foil composite into a circuit, and (4) an adhesive of the metal foil composite formed with the circuit. Removing the resin film, bonding to the metal plate via the insulating adhesive composition, and curing and integrating the insulating adhesive composition. It is. [Selection diagram] Fig. 1
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Total number of triples: 26.