http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002265754-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2001-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 |
| publicationDate | 2002-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002265754-A |
| titleOfInvention | High relative permittivity B-stage resin composition sheet and printed wiring board using the same |
| abstract | (57) Abstract: A high-permittivity B-stage resin sheet and a printed wiring board using the same are obtained. SOLUTION: (a) an epoxy resin which is liquid at room temperature, and (b) In an epoxy resin composition containing a thermosetting catalyst as an essential component, 80-99 insulative inorganic filler with relative dielectric constant of 500 or more at room temperature A high-permittivity B-stage resin composition sheet obtained by using a resin composition containing 1% to 75% by weight of an insulating inorganic filler and 1% to 75% by weight of the insulating inorganic filler. And a printed wiring board using the resin composition sheet. [Effect] A resin sheet having a high relative dielectric constant can be produced, and a printed wiring board having a high relative dielectric constant, which is excellent in heat resistance, electrical properties after moisture absorption, adhesion to copper foil, strength, and the like, can be produced using the resin sheet. Was. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005285540-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011048885-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008036994-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9497857-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009113465-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016139794-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102576585-A |
| priorityDate | 2001-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.