| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 |
| filingDate |
2005-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d878adecaf4e06dd9eff709d0991747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e24b4095e4f8764097f820065ae9a43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11b689e6d53175d07b74a4b2909f8f30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_490412a1857d880ba7252d27c813061f |
| publicationDate |
2009-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7524893-B2 |
| titleOfInvention |
Conductive adhesive |
| abstract |
The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8488271-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010044088-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014318615-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D897297-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D904990-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8339771-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011002212-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010009153-A1 |
| priorityDate |
2004-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |