abstract |
A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25° C. or has a viscosity of not less than 400 Pa·s at 25° C. and of not more than 200 Pa·s at 80° C.; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition. |