| abstract |
(57) [Summary] [Structure] Silver powder, an epoxy compound having a naphthalene skeleton, and a compound having two phenolic hydroxyl groups in one molecule are essential components. 0 to 85% by weight, 3 to 20% by weight of an epoxy compound having a naphthalene skeleton, and 0.1 to 20% by weight of a compound having two phenolic hydroxyl groups in a molecule. Resin paste. [Effect] Good coating workability during dispensing. The cured product has a low elastic modulus and a low water absorption. Furthermore, since the decrease in adhesive strength due to water absorption treatment is small, even in the combination of a copper frame and a large chip, the distortion of the chip due to the difference in the coefficient of thermal expansion between the frame and the chip is very small, especially when used in a thin package during solder reflow. No cracks occur. |