| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-215 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D301-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1997-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1999-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8facd65401511ccb12d277108325c787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b585ce98e55aa861e65e92f8b858b5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad0cd7ce5c40fe7554ef392baa27491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4d0035f975865f5e463ca85e3e307ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da |
| publicationDate |
1999-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5939509-A |
| titleOfInvention |
Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| abstract |
The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007185243-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7524893-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005227393-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7527991-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004229404-A1 |
| priorityDate |
1995-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |