| abstract |
(57) [Problem] To provide a copper-based conductive adhesive which has sufficient strength and conductivity, and has a small variation in these characteristics due to an environmental test. SOLUTION: A metal filler containing at least 50% by weight or more and 100% by weight or less of copper, an epoxy compound, A conductive adhesive comprising a novolak type phenol resin, a low molecular weight polyvalent phenol and a curing agent. |