| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2014-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cd69a1a2d25d441cbe67c970c9de458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76196f0f9ef064d3c70f844d98b2fb6b |
| publicationDate |
2016-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016023279-A |
| titleOfInvention |
Resin composition for sealing, semiconductor device and structure |
| abstract |
The present invention is to more stably perform sealing molding of a semiconductor element. The encapsulating resin composition is made of a granular material containing a thermosetting resin (A), has a rectangular pressure measured by a rectangular pressure test of 2.0 kgf / cm 2 or less, and a half-shot index. In the test, no adhesion to the metal plate is observed. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102017202112-A1 |
| priorityDate |
2014-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |