http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014118461-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2012-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5d33734119af782c5f2882e277a6583 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0276927982e7f5d9a29ff68fd0a30f77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51893bb219947ba0a43bfbaf3bf133e8 |
| publicationDate | 2014-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014118461-A |
| titleOfInvention | Powdered resin composition for encapsulating semiconductor and semiconductor device |
| abstract | Provided are a resin composition for encapsulating a granular semiconductor and a semiconductor device excellent in moldability, in which a wire flow rate is low, resin leakage is small, and the moldability is a semiconductor device formed by compression molding. A resin composition for encapsulating a granular semiconductor comprising (A) a biphenyl type epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) spherical silica as essential components. ) After spherical silica is contained in the resin composition in an amount of 80% by mass or more and less than 95% by mass and the particle size distribution is within a predetermined range, and the resin composition for encapsulating a granular semiconductor is heated and melted In a histogram of luminance values obtained from the melt surface of the above, a granular semiconductor encapsulating resin composition having a skewness of 0 or more and less than 2.5 and a kurtosis of 0 or more and less than 5, using the resin composition A semiconductor device obtained. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017053861-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014125592-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016183309-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016023279-A |
| priorityDate | 2012-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.