| abstract |
A granular epoxy resin composition for encapsulating semiconductors with excellent productivity when a semiconductor element is encapsulated by compression molding using the granular epoxy resin composition for encapsulating semiconductors to obtain a semiconductor device. And a semiconductor device with excellent reliability. An epoxy resin composition for semiconductor encapsulation used in a semiconductor device in which a semiconductor element is encapsulated by compression molding, wherein a JIS standard sieve is used for the entire epoxy resin composition for semiconductor encapsulation. In the particle size distribution measured by sieving, the proportion of particles of 2 mm or more is 3% by mass or less, the proportion of particles of 1 mm or more and less than 2 mm is 0.5% by mass or more and 60% by mass or less, and less than 106 μm A granular epoxy resin composition for encapsulating a semiconductor, characterized in that the proportion of the fine powder is 5% by mass or less. [Selection figure] None |